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February 14, 2024

For organizations operating high-performance data centers, cooling is a significant challenge. High-end processor TDPs are also climbing with each generation, and we are rapidly approaching the point where air-cooling will become infeasible. Liquid cooling is an obvious answer but brings new challenges, including cost, maintenance issues, and concerns about leakage and safety. In a recent

January 24, 2024

Machine learning (ML) is used for multiple healthcare and life sciences (HCLS) applications, including medical imaging, protein folding, drug discovery, and gene editing. While Nextflow pipelines (like those in nf-core) are commonly used for genomics, they are also being adopted for machine learning workloads. In this artice, we explain how to build an example Nextflow

December 18, 2022

Financial institutions (FIs) face unprecedented challenges. With increasing consumer expectations and megatrends such as mobile banking, alternative lenders, and cloud computing, banks are under intense pressure. They need to innovate faster, offer new services, and deploy new applications to serve their customers better. Despite these imperatives, data center growth rates have become unsustainable. The need

September 6, 2022

With the launch of AMD EPYC™ 7003 series processors with 3D V-Cache™, we needed to update prior whitepapers for EDA and CAE. These technologies are game changers. Checkout our latest assets at these links: Realizing a more productive EDA environment A new standard in CAE solutions for manufacturing  

July 18, 2022

There’s perhaps no field more demanding than modern semiconductor design. In both research and commercial settings, customers expect new electronic devices to be faster, cheaper, smaller, and more energy-efficient with each generation. Semiconductor producers rely on electronic design automation (EDA) tools to realize these improvements. Few understand these challenges better than CEA Tech, the Grenoble-based